Saturday, January 20, 2018

HP announces new 2-in-1 detachable device at MWC 2017

Targetting today’s mobile professionals who want a stylish device that is easy to use, HP Inc on Sunday announced a dynamic new commercial 2-in-1...

GIGABYTE Announces New AM4 Ryzen Compatible Motherboards of AORUS X370, B350 and A320

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards and graphics cards, is proud to announce the rise of the AORUS Gaming Series Motherboards...

With Unifying Strategy Intel Security rectify Cybersecurity Fragmentation

  News Highlights “Together is Power” comes to life with integrated, automated solutions, expansive partner ecosystems and cross-industry collaboration Available now new McAfee Enterprise Security...

Cyber Security Predictions: Looking Back at 2016, Peering Ahead to 2017

Authored by Nikhil Taneja, MD, India SAARC, Radware Cyber-attacks have become commonplace. In many ways, the only “news” is that they continue to grow in...

MWC 2017: Zyxel to debut new premium LTE indoor gateway LTE5366

~ The LTE5366 provides superior Wi-Fi experiences with 11ac Wave 2 technology in combination with LTE CAT6 ~ Zyxel Communications, a global leader in networking...

Dubai Is Set to Launch the World’s First Hover-Taxis Within Months

Officials from Dubai's state transport authority have announced that they aim to have hover-taxis up and running by July this year, with passengers able...

IBM and Ericsson Hype 5G Array Advance for IoT, VR

IBM and Ericsson said the end result of a two-year collaboration is a silicon-based 5G millimeterWave (mmWave) phased array circuit that can operate at...

Utilities to drive IoT Security Market Growth

A new study has found that utilities will be among the sectors rushing to keep their fast-growing Internet of Things (IoT) systems safe, driving...

Toshiba Launches 8TB HDD for NAS Applications

Toshiba Corporation’s Storage & Electronic Devices Solutions Company today announced the launch of a new line-up of HDDs, “MN Series”, for network attached storage...
3D NAND CHIP

Westrn Digital Introduces World’s First 512 GIGABIT 64-Layer 3D NAND CHIP

Western Digital Corp. announced that it has commenced pilot production of the company’s 512 Gigabit (Gb) three-bits-per-cell (X3) 64-layer 3D NAND (BICS3) chip in...